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World Wide Group Technology Leads the Future
提供一站式高端线路板设备专案服务 Provide one-stop high-end circuit board equipments project services
環球電路板設備有限公司 World Wide P.C.B.Equipments Company Limited
COMPANY PROFILE公司简介
World Wide P.C.B.Equipments Company Limited環球電路板設備有限公司
Founded in 1990,World Wide Group is a diversified enterprise integrating high technology, premium quality,exceptional service,and professional management.We provide the printed circuit board (PCB) industry with advanced production processes and supporting equipment, delivering a one-stop solution that includes both software and hardware configurations.
Having been deeply engaged in PCB equipment distribution and representation for 35 years, the Group merges technologicalinnovation with smart manufacturing,fully embracing the Al digital era. We provide comprehensive,full-process supporting services that cover equipment installation, commissioning,training,maintenance,and system integration.Amid the rapid development of the 5G,6G,and Al server industries,PCB manufacturing is currently transitioning toward high precision and intelligence. Relying on a mature management system, reliable equipment, and a professional after-sales team，World Wide Group has earned the deep trust and recognition of major PCB manufacturers.We continuously introduce Al-powered smart manufacturing equipment to facilitate the high-end upgrading of the domestic PCB industry.
Driving the upgrade of smart manufacturing through innovation,we will continue to expand our smart equipment product lines and enhance our ful-lifecycle operation and maintenance services in thefuture,joining hands with industry peers toembark onabrand-newjourney of development.
World Wide Group's main PCB customer application areas
HDlandhigh-densityinterconnectcircuitboards
High multilayer PCB production
集团分布
East China Region
The Suzhou office iscurrentlyunderorderly preparation.
Land area:1,ooo square meters.
Service Business:
Focusingon R&D,training,and the enhancement of technicalservices. Focusingon technical sharing and R&Dlearning forequipment such as Mitsubishilasermachines.
KEYAOMICRO-ELECTRONIC(GUANGDONG)LIMITED
Buildingarea:2,8oo square meters.
Service Business:
Providing Chinese customers with one-stop semiconductor packaging/ high-end printed circuit board (PcB)equipment installation,customer training,parts supply,equipment maintenance,and technical services.
WORLDWIDEP.C.B.EQUIPMENTSCO.,LTD. WORLDWIDESEMI-CONDUCTOREQUIPMENTCOMPANYLIMITED KEYAO MICRO-ELECTRONIC(HONG KONG) LIMITED
Land area:6,200 square meters.
Service Business:
Designingand developinga complete and comprehensive real-time intelligent data management system.
Independently developingand integratingbrands,and working with partners to establish a strong,high-quality PCBand packaging substrate equipmentalliance.
KEYAO MICRO-ELECTRONICS(THAILAND) CO.,LTD.
Buildingarea:5oo square meters.
Service Business:
Providing overseas customers with one-stop semiconductor packaging /high-end printed circuit board (PCB)equipment installation,customer training,parts supply,equipment maintenance,and technical services.
PrimaryBusiness主营业务
Professional Services Equipment PerfectAfter-sales EquipmentMaintenance One-stop,comprehensive Processsupporting Servingcustomersand Consumable spare parts projectservicesforprinted equipmentforprintedcircuit improvingefficiency. andtechnical support. circuit boards(PCB) and boards(PCB)and
semiconductor packaging semiconductor packaging 中 substrates. substrates.
Examplesofapplications
Leading in high productivity in industry
The core components of Mitsubishi Electric unique technology，equipped with a newly developed new resonator and a new galvano,This increases productivity by about 3 0 % .Achieve unrivaled productivity,stable machining quality,and excellent positioning accuracy.
It supports thevisualization andautomation oflaser processing
It is compatiblewith the international standard OPC for FA communication. Enablecollaborationwithon-site production management systemsand SCADA.In addition,as standard it is equipped with pulse energy monitoring function that monitors the energy of each machined hole to achieve traceability,increase efficiency rate.
YOURSOLUTIONPARTNER CO2Laser
Superior processing stability
《Key Technologies》LaserResonator/f0 lens/Galvano /Control unit
LaserResonator
Mitsubishi Electric in-house developed laser resonator can vibrate short pulses from high peaks Laserbeamswithlongest pulses.Theindependentlydeveloped resonatorensures high processing capabilitiesand excellent performance in a variety of processing fields.
Three-axis orthogonal oscillator structure
Total Reflector (TR)
High productivity
《KeyTechnologies》 "Key Technology" laser resonator/ Galvano
Galvano
The latest ultra-high-speed Galvano and highprecision controltechnology have achieved highest production efficiency in industry.
Synchrom technology
After the machining table is moved,unlike the conventionallaser processing control method, when machining table is moved,laser processing atthe same time,so the non-processing timeis
It is possible to generate highly stable pulsesthatare independentof the frequencyof the Galvano.Weensure excellent stabilityand quality in a variety of processing fields.
Stable pulse waveform
Low operating costs
《KeyTechnologies》laserresonator
Laserresonator
Laserresonator,which can be easily updated by onlyreplacement parts,and the independent technology guarantees low operatingcostsand high equipment operating efficiency.
AUTOMATEDLAMINATIONMACHINE (For Multilayer& HDl PCB Application)
World No.1 Automated Lamination Machine forPCB Fabrications.
Unique Design forFineLine PCB Production with Stable Performance.
Features
· Compatible with various board thickness,
includes ultra-thin panels.
· Options for inner and outer layer lamination.
. High productivity with max utilization.
. Uniform pressure distribution.
. Precise copper retention.
. Easy maintenance with minimized machine down-t . Offline Dry-film Cartridge system.
Laminationpressuredistribution
Easy lamination rollerexchange system
· High stabilitywith precise lamination accuracy.
· Unique lamination roller design forenhanced temperature and pressure uniformity.
·Quick roll exchange system for minimized machine downtime.
.PLC control compatible with various MES protocol.
.Customizable machine configurations for best lamination performance.
AUTOMATICEXPOSURESYSTEMFORFPC(Roll-to-Roll)
The system is suitable for vertical exposure as well as roll-to-roll automatic exposure,and achieves high accuracy with low tension alignment.There is a partialarea alignment function (optional).
Equipmentfeatures:
The roll-to-roll automatic exposure machine solvestheproblem ofFPC
Solivesthe proble 2 5 0 \mathsf {mm } F 5 0 0 \mathsf {mm } with) Move direction · High alignmentaccuracy on the frontand back sides Roll Type Vertical Exposure Hakuto ? High productivity · Down-Blow technology clean up filmand FPC · Sheet-to-rollfunction UsingFPC'sowngravity,lowtension,toavoid ·Avariety of alignment methods,corresponding to FPCdeformation
Simultaeuiteosutsdet VS
achieve precise alignmenteffect
· The FPC upper and lower part are not affected by Horizontal exposure for otherbrands tension to achieve precise alignment ?Horizontal: Tension isapplied,which can Itcan be applied to glass masks andfilm masks easilydeformtheFPC
Movedirection
Energyinnovation technology to reduce operating
costs R R Low maintenance costs
DIRECTIMAGINGSYSTEM
Equipmentfeatures:
UV-LED multi-wavelength exposure
The lightsource is an energy-saving,long-life,and environmentally durable LED.Use SCREEN-specific technology,which efficiently synthesizes multiple wavelengthsand irradiates energyuniformly from the top to the bottom of solder mask.
Whetherit's ink,high-sensitivity dry films,or the common ones used in traditional contact exposure equipment and projection exposure equipment Dry film,this device providesa high level of Dl exposure quality forall types of light-sensitive materials.
High-speed alignmentscanning
The alignment scanning function does not pause work table
operation,and the multiple targets can be read and scanned without pause.
Compared to the traditional step-by-step alignment method,even high-density targetsubstrates are possible
Read aligned targets in short period of time to increased productivity and accuracy.
Models can be selected from mass production to prototype and smallbatch production
ThefullrangeofLediaequipmentisavailablenotonlyinanautomaticsingle-sidedexposuremodel,butalsoinanautomatic double-sidedexposure model,whichhasbeenaddedsubstrateflapdevice;Thereisalsoamanualexposuremodel.Userscan choosetherightoneaccordingto theirneeds includinghigh-volumeproduction,prototype,ndsmall-batchproduction.
※Inaddition,wehavedevelopeda"Basic ManualExposure Model"withintegratedfunctions.Formoreinformation, pleasecontactoursalesstaff
DIRECTIMAGING SYSTEM(DUALTABLEMODEL)
By maintaining the highest quality, productivity can be increased by1.5 times
While maintaininga high level of exposure quality, productivitycanbe increased byup to1.5 times. The dual-table Ledia modelcontinues maintain highlevel of exposure quality and alignmentaccuracy.New double table design,Reduce the time of machine alignment scanningand board exchange.Compared to conventionalsingle-table modelswith standard LED light sources,productivity is up to 1.5 times higher.
Enables smaller machine installation space
It canbeconfigured to load and unload automatic lines ina smallerspace.
Floorspace is reduced by 6 0 % compared to the previous model,maximizing productivity.Multiple substrates can be exposed at the same time.
It supports simultaneous exposure of2or4substrates,which greatly improves the production efficiency of FPC substrates.
Multiple substratescanbe exposedat the same time
Simultaneous exposure of2or4substrates greatly improves FPC substrate productivity.
Ledia
Double tablemodel-LediaTwin
Highest quality and highest throughput
Load/Unload time Scanning alignment time
| LI-TW-S | |
| Light source | UV-LED365+385+405nm |
| Number of shots | 5or6 |
| Maximumexposure area | 5 head:540x 661mm 6head:610x661mm |
| Minimum line width (L/S) | 30um |
| Equipmentsize | W2,000mm D3,460mm |
| Equipmentweight | H2,213mm 5,000kg |
\*The above specifications are for reference only and asubject to the manufacturer's final design.
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Compatible todry filmand solder mask inks.The wavelength output ratio can be controlled independently,and low exposure is realized, inorder to reduce the environmental impact, contribute to the reduction of production costs.
Autofocus function
Real-time monitoring of the curved surface of the substrate during exposure,automatic adjust the height of exposure head,avoiding back warping, and maintaining stable high quality.
Auto-Correction Function
Maintains the amount of light between the exposure heads, and the auto-correction functionmaintainsstable accuracy,reducing machine down time, thereby reducing equipment downtime.
High-speed and high-precision automaticalignment
High-speed and highprecision automatic alignment:Through scanning and photography, multi-point high-speed camera and multiple alignment algorithms achieve different expansion and contraction compensation requirements
Automation solutions plan
SCREEN is present in a wide range of high-tech applications such as semiconductors and LCD panels,so that it canmeet the requirements of Industry 4.0 specifications.
DIRECTIMAGINGSYSTEM
SCREEN has refined its unique optical design，image processing，and direct imaging technologies over many years selling scanners,laser plotters. direct imaging systems,and other related products.The Ledia 8 incorporates these core technologies to deliver even higher accuracy, reliability,and productivity.
Achievinga significant improvement in imaging positional accuracy
Corresponds to board warpage
It provides stable imagingquality with various mechanisms that can automatically handled for warpage regardless the type of board.
Alignment processing
The Ledia 8 is equipped with a variety of alignment functions to meet the increasing demands for alignment accuracy requirements.
Distortion correction
Three-wavelengths
The cross -sectional shape of the photosensitive material can be controlled by adjusting the wavelength mixing ratio.
Three-wavelengths LED lightsource
Automation And Online-host Support( secs/gem )
X-RAYTARGETDRILLINGMACHINE(HDI&HIGHENDMULTILAYERBOARD)
INSPECTA COMBO Drill and Routing Dual-purpose X-ray TargetDrill Machine
| Shape and diameteroftarget reference | Circle (0.5-3.5mm) (0.0196"-0.1378") |
| Abnormalboarddetectionstandard | point-to-point,layerdeviation,overall and comprehensive tolerances |
| Board thickness | Range: From 0.1mm to 15 mm[Optionalup to 20 mm] |
| XL,XR and Y-axismovement acceleration | Linearmotor60m/min (2362in/min) |
| X-Y Positioning Accuracy | 0.005 mm(0.196 mils) * |
| X-Y Positioning repeatability 0.004 mm (0.157 mils) | 0.004 mm(0.157 mils) * |
TECHNICALFEATURES
INSPECTA SX INSPECTA S1 INSPECTA COMBO
Drilling system
| Air spindle 80k rpm | (Optional125krpm)125k rpm) | (Optional200krpm)125krpm) | RritingSped:170k-200krpm |
| Numberof spindle | 1 | 1or2 | 2 |
| Tool changing system and number of tool magazine | Manualtoolchange Auto toolchange (Optionalautomatic tool change+5tool magazine) | (Optionalautomatic toolchange with 140 tools magazine) | automatic toolchange with 140 tools magazine |
| Drill Diameter | 0.1-6.35 mm (0.004"-0.250") | ||
CCD camera and X-ray system
| Numberof CCDcamera | High-resolution CCD camera with integrated high-resolution controller/one active area 9.6×12.8mm(0.3779"×0.5039")-resolution15LP/mm,33μm |
| X-ray systemand quantity | Microfocus X-raysourceisdriven bya linearmotor/onemotor |
| Drill area | 835x 620mm (32.9"x 24.4) | 1220 × 835mm (48x 32.9) |
| Inspectionarea | 790 x 620mm (31.1"x 24.4") | 810 x 690mm (31.7"x 27.1") |
Options: Various automation systems:
X-RAYcamera
·HIGH-RESOLUTIONX-RAYLENS
·Perform high-intensityexposure (for thickerboard)
·Average image data to reduce distractions
·All parameters are controlled via software
· The camera is equipped with a press foot to keep the board flatand touch the work surface to reduce impact of deviations.
Label the production board with a QR code,cooperatewith scanningand reading data,and automatically confirm the process
QR code labeling system (optional)
Detection method It canbe detected according to different specificationsofthetarget
·Concentric targets
·Fool-prooftargets
·Overlapping targets
·Independent layer targets
·Acombination of theabove methods
Categorization (grouping) function
This feature is used to label differenttype of boards Example: · ClassA/group=±0.025mm(1mil) · Class B/Group \mathbf { \tau } = \mathbf { \tau } ±0.050mm (2mils) · Class C/group \mathbf { \tau } = \mathbf { \tau } ±0.075mm (3mils)
Statistical data
Through Pluritec'sGUlinterface,information datacan be processed quickly,integrate database and printing,or connected to the customer'sMES system for real-time managementofequipment
·Whole Boardandlayer-to-layererrors
· Point-to-point/layer-to-layer positioning
·Expand or Contract/standard deviations,etc
· Specify the lot size
· Batch of innerboard
·Layerswithin the board
Distinguish the choice
·Stretch and shrink
·Diffusion error
·Errorbetween upperand bottomlayer ·point-to-pointerrorwithin the layer
MVLPa500/600VACUUMLAMINATOR
Features:
· Thediaphragm typevacuumlamination pressurizes the product comprehensively and uniformly
· The substrate isconveyed with PET film
·Pressure and vacuum levelcan be controlled in multiple stages
· The fully automatic vacuum laminator can be connected to the pre-processand postprocessequipmentensurethatthe productisfreeof bubblesand dry film wrinkles.
For products: PCB/FPC/HDI For process: DF/PIC lamination
Film effect:
MVLP50O/60O-IIWVACUUMLEVELLINGMACHINE
IFeatures:
·The diaphragm typevacuum lamination pressurizes the product comprehensivelyand uniformly
·Thesubstrate is conveyed with PET film.P
·pressure and vacuum levelcan be controlled in multiple stages
·The automatic vacuum leveling machine can be connected to the pre-process and postprocess
·Vacuum lamination (first stage) ^ + pressing leveling(second stage)
|Forproducts:HDI/IC Substrate |For process: Coating SM/DFSR/ABF laminating ^ + leveling
Leveling Effect:
2 -stage function 1 stage function Heating Vacuum Pressing Heating Pressing ！ Flat Pressing Vacuum laminating The heated steel plate is The vacuumchamberis heated at the same pressurized toachieve a high-level time as theairis pumped surface flattening effect Bubble-free orwrinkle-freeisachieved under vacuum
RIGIDANDFLEXIBLEBOARD PRE-LAMINATOR
Equipment Features:
·Application: Flexible PCBs,IC package substrates,dry films,dry film type inks,ABF
· Substrate size: MIN 2 5 0 x 2 5 0 {mm } ,MAX 6 2 0 x 5 2 0 {mm }
·Substrate thickness: 0 . 0 5 ~ 3 . 0 {mm }
·Dry film cutting accuracy: <=slant 1 \mathsf {mm }
·Panel conveying speed: 0 . 0 5 { ~ } 5 . 0 { m / m i n } (adjustable)
·Cycle time:≤35 sec/panel
· Dual-panel arrangementfunction: 2 5 0 x 5 0 0 {mm } \left( 2 x 1 \right)
·Pre-lamination accuracy: Double-sided pre-lamination accuracy ≤1mm (including front/back,left/right,and front/rear positioning)
Advantages& Features:
· Specifically designed and manufactured to integrate with JSW single-stage vacuum laminators.
： 9 0 ^ { \circ } roboticarm rotation function,enabling dual-panellamination to meet customer left/right or front/rear layout requirements.
· Built-in cleaning system.
·Improves yield rate and production efficiency of vacuum laminators,resulting in reducing labor co
MHPCSERIESHOTPRESSMACHINE
Platen Size(Min: 350x350mm to Max: 1300x3200mm) Production(up to 36 openings ); Automation and Centralized Control
The MHPC hot press isamachine that pressesand laminates filmsor
copperfoilsonto the bstrates such as printed circuitboards.
Uses high-precision machined heating plates,with heating controlled via thermal oil, steam,orelectricheaterstoensurehigh flatnessofthe products.
Heating plate sizes range from 3 5 0 x 3 5 0 {mm } to 1 3 0 0 x 3 2 0 0 {mm }
Number of openings from 1to 36,pressure range from 10 to 2500 tons,
and vacuum function available forall models.
Over1,0o0 unitsof the MHPC serieshavebeen sold.
Large-sized Machine
Bigand high-precision machining heatingplates, Max.up to 3 2 0 0 \mathsf {mm } ：
High production efficiency and uniform flatness. Applications:Copper Clad Laminate(CCL),Plywood, Decorative Panels.
Medium-scaleModels
Heating speed controlled by thermaloil orelectric heaters. Provided high flatnessand temperature uniformity. DegreeofVacuum,below10hPaisavailable.
Products Application (as shown in the image)
Automation
Products are automatically
transferred to each press.
Fullyautomatic loaders and
unloadersareavailable.
More than 20 presses can be linked together. Reduces manpower,ensures stable
productsquality,andenhances
production efficiency.
Includes hot press,storage system, and loading/unloadingunits.
Small-sized Testing Machine
Compact vacuum hot press,suitable for new materialand product development. Heatingup to 4 0 0 ^ { \circ } \mathsf C using electric heaters. Cooling controlled by compressed air and cooling water.
MHPC-MES/CentralControl
Each press is controlled by
a centralized computer system.
Supports remote operation,monitoring, and data collection.
Preset setting values,current setting,
systemstatus,andalarms canbemonitored
AUTOMATED OPTICAL INSPECTION (AOI)
RTRAOI-- [RA Series』 Panel AOl -- [SX Series』
Application Aviation 口 Autive Electronic Medical
RTR AOI
? RTR FPC inspection with MIN \mathsf { L } / \mathsf { S } { = } 8 / 8 ~ \mu \mathsf { m } o Continuous inspection ensuring fast inspection speed o With Al function,extremely low false alarm rate ※ Optional AOl with dual-sided inspection
Panel AOl
o Inspection of fine line with min \mathsf { L } / \mathsf { S } = 1 . 5 / 1 . 5 \mu \mathsf { m } o Proprietary algorithm& stable detection o With Al function,extremely low false alarm rate ※Optional AOl with zoom camera
| RA Series (RTR) | SX Series(Panel) | |
| Apply to | Consumer electronics FPC/LED/EV (RTR) | IC substrate/Panel FPC |
| Maximum size | Product width:250~ 520 mm | L740xW 640 mm |
| MIN L/S | 8/8 μm ~ 70 /70 μm (Customized) | 1.5/1.5 μm ~ 50 /50 um (Customized) |
| Inspection speed | Up to 10.8 m/min | 48 sides/h @9 um，75 sides /h @18um |
| Camera | Color 16K TDI | Color 16K TDI |
| BVH/TH inspection Minimum hole diameter 30 μm | Minimum hole diameter 20 μm |
AUTOMATEDVISUAL INSPECTION (AVI)
Panel AVI -- 『AVSeries』 Strip AVI -- [BF Series』
Application Aviation 1 Autive Electronic Medical
Panel AVI
o With 16K color zoom camera,enabling in-line review oPartitioned inspection,extremely high detection rate With Al function,extremely low false alarm rate
※Optional AOl with zoom camera
Strip AVI
? Double-sided inspection with zoom CCD o Three-lighting condition inspection With Al function,extremely low false alarm rate
※ Optional AOl for single unit inspection on trays
| AV Series(Panel) | BF Series(Strip) | |
| Apply to | IC substrate / HDI | CSP /BGA |
| Maximum size | L740xW 640 mm | L300xW150 mm |
| Inspection capability | Min defect size 7 μm | Min defect size 7 μm |
| Inspection speed | 50 sides /h | 180 Strips / h |
| Camera | Color 16K TDI | Color 16K TDI |
| Illumination | Multi-lighting inspection | Multi-lighting inspection |
Image Measurement Instrument
Image measuringinstrument equipped with near-infrared light source QUICK VISION NIR
The Quick Vision series supports RGB color lighting with betteredge detection performance.
Tofurther enhancethe observational performance of advanced packaging measurements，support can be provided.
Themodelofnear-infrared lightsource.
※图示为QVHYPER606Pro
Main specifications of equipment
| HYPEROUICKVISIONNIR606 | ||
| Measuring range | 600×650×250mm | |
| Measurement accuracy | E1xEy | 0.8+2L/1000μm |
| E1z | 1.5+2L/1000μm | |
| E2XY | 1.4+3L/1000μm | |
| Resolution of scale | 0.02μm | |
| Image sensor | Black and white CMOS digital camera | |
| Observation unit | 1x-2x-4x-6x Electric turret | |
| Illumination unit | Contour illumination | LED(White) |
| Vertical lighting | LED(White/blue/NIR) | |
| Ring lighting | LED(White/blue /NIR) | |
Application examples of models equipped with near-infrared light sources
■Samples of multi-layer PCB boards that can penetrate ABF materials and solder resist for measurement. No needforlaserdrillingcanreduce thenumberofprocesses,sothereisno need toworyaboutlaserdamagetothesample.
■The built-incomponents configuredin theinterlayer materialcan be observed and measured. Itcanaccuratelymeasurethelaserprocessngdeviationdueto thermalexpansion,etc.,therebyimprovingtheyield
OLS-DRIGID
System Features
The Optical Lay-up Station (OLS-D) is a fully automatedsystemcoveringpanel registration, material loading,and unloading processes. Key featuresincludeweldbarsandweld headsthat automaticallyadjust todifferentpanelsizesand welding positions.Designed for high-volume manufacturingenvironments,thesystem features dualweldingstations formaximum throughput.While onepanelisbeingwelded,anothercanbealigned simultaneously,significantly increasing overall output efficiency.
All OLS systems come standard with SmartWeldTM induction welding technology combined with an opticalalignmentsystem.These technologies eliminate the need for traditional mechanical fixtures, increasing process flexibility.By shortening cycle timesand reducingoperatingcosts,it provides superior layer-to-layeralignmentaccuracy compared totraditional pinsystems.
3
Equipped with an opticalalignment system,the OLSD precisely alignsand clamps multiple PCB layers in sequence.Subsequently,SmartWeldTM induction welding technology fuses thealigned multilayer boards,securingand lockingalignmentaccuracyat multiple positionsalongthe panel edges.
Tofurtherenhance alignmentaccuracy,the system includeskeyfeaturessuchasabarcodescannerfor errorproofing.Italso includesthickness measurementforinnerlayersand prepregfor validation,ensuring stable and reliable process quality.
Processing Capability
? Minimum Size: 1 2 x 1 4 in ( 3 0 5 x 3 5 5 { {mm } ) } （204号 ? Maximum Size: 2 4 x 3 0 in ( 6 1 0 x 7 6 2 {mm } ) （2 ③ Alignment Accuracy: ± 1 2 \mu { m } orbetter
Capable of aligningultra-thin cores:1 mil - 2 5 \mu { m } ? Maximum welding thickness:8 mm ○ Maximumwelding temperature: 3 0 0 ^ { \circ } \mathsf { C } （204号
Energy savings compared to traditional heating systems: 76%
Energy savings compared to other induction heating systems: 2 7 %
Technical Specifcations
| Energy Consumption Comparison Table | ||||
| Item | Traditional Heaters | Other Induction Heating Systems | DIS Induction Heating | Energy Unit |
| Number ofweld heads | 12 | 12 | 4、8或12 | Watts |
| Heating state/Active mode | 210 | 75 | 55 | Watts |
| Standbystate/Idlemode | 105 | 0 | 0 | Watts |
| 50%Workload | 158 | 38 | 28 | Watts |
| 85%Workload | 194 | 64 | 47 | Watts |
| 12ofweld heads @85% | 2520 | 900 | 660 | Watts |
The Next Evolution in Mylar Peeling Technology
PEELMASTER-PMASeries
Austrian Smart Automation Specialist -- Advanced Engineering
Proudly presents its latest generation of fully automatic peelers -- PEELMASTER-PMASeries.
They handle panel widths up to 630/730 mm.Specially designed for PCB & substrate manufacturing processes and suitable for cleanroom applications.
Product Features
o Idealfor peeling the Mylar film off DFR on high-layer and multi-layer HDl panels
○Equipped with a proprietary Mylar detection system to effectively monitor the peeling performance
o Integrated with an automatic buffer unit to prevent NOK panels from entering the subsequent process
o Streamlined PETwaste management system enables efficient material recovery and workshop management
。Industrial-grade PLC control system supports Industry 4.0 and SECS/GEM communication protocols
1990 Founded:WorldWide IndustrialLimited
1996
Founded:WorldWide
P.C.B.Equipments Company
Limited
2003 Founded:Dongguan KeYao Equipment Company Limited
1995 Dongguan Office established
1999 Shanghai Office established
2004-2012 Service outlets successively setup in Zhuhai, Kaiping,Shanwei, Chongqing, Kunshan,Wuxi, Nantong(Jiangxi) and Longnan.
2023-2026
Founded Ke Yao Group and Ke Yao
Micro-Electronic (Hong Kong) limited
out business spin-off and
restructuring to operate original
business segments
independentlyExpanded 3,700 sq.m
logistics centre to boost productivity
and expand business
2019
2015 Founded:World Wide Electro-optics Technology Equipments Limited
Hong Kong expands2,5o0 square meters of logistics storage "Rocket Data Technology Limited" and becomes a global strategic partner
2021
Founded:
World WideSemi-Conductor EquipmentLimited
2018
Founded:Golden Innovation Technology
Development Limited
里程碑 1990-2026Milestones
Hong Kong Headquarter
World Wide Group 16 Yip Wo Street On Lok Tsuen Fanling.N.T Hong Kong
TEL:+8522415 6686
FAX:+85224153130
Website:www.worldwidegroup.com.hk E-mail:sales \ @ worldwidegroup.com.hk WORLDWIDE INDUSTRIALCOMPANYLIMITED WORLDWIDEP.C.B.EQUIPMENTSCOMPANY LIMITED
WORLDWIDESEMI-CONDUCTOREQUIPMENT COMPANYLIMITED
